SikaBond®-54 Parquet
SikaBond®-54 Parquet is a 1-component, solvent-free, wood flooring adhesive with very good workability.
- Economical, low consumption
- Adhesive can be sanded
- Floor can be sanded after 12 hours
- Elastic, footfall-sound dampening properties
- Suitable for bonding directly on old ceramic tiles
- Suitable for use with underfloor heating
- Very low emissions
- Reduces stress transfer between the wood floor and the substrate
Usage
SikaBond®-54 Parquet is designed for full surface bonding of solid and engineered wood floors, mosaic parquet, industrial parquet, lam parquet, residential wood floors and paving, as well as chipboard floor systems and subfloors.SikaBond®-54 Parquet is designed for use with most common types of wood floors and is especially designed for use with challenging woods.
Advantages
- Economical, low consumption
- Adhesive can be sanded
- Floor can be sanded after 12 hours
- Elastic, footfall-sound dampening properties
- Suitable for bonding directly on old ceramic tiles
- Suitable for use with underfloor heating
- Very low emissions
- Reduces stress transfer between the wood floor and the substrate
Packaging
13 kg / 6.5kg metal pail
700ml foil
Colour
Parquet brown
Product Details
ENVIRONMENTAL INFORMATION
- EMICODE EC1PLUS R
- LEED v4 EQc 2: Low-Emission Materials
Chemical Base
i-Cure® Technology polyurethane
Shelf Life
SikaBond®-54 Parquet has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.
Storage Conditions
SikaBond®-54 Parquet shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.
Density
| ~1.30 kg/l | (ISO 1183-1) |
Shore A Hardness
| ~35 (after 28 days) | (ISO 868) |
Tensile Strength
| ~1.5 N/mm2 | (ISO 37) |
Shear Strength
| ~1.5 N/mm2 (1 mm adhesive thickness) | (ISO 17178) |
Service Temperature
+5 °C min. / +40 °C max.
Application
Sag Flow
SikaBond®-54 Parquet spreads very easily whilst maintaining stable trowel marks.
Ambient Air Temperature
+15 °C min. / +35 °C max.
Relative Air Humidity
40 % min. / 70 % max.
Substrate Temperature
During laying and until SikaBond®-54 Parquet has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without, and between +20 °C and +35 °C with, underfloor heating
Substrate Moisture Content
| Type of screed | Use without underfloor heating | Use with underfloor heating |
| Cement screeds | 2.0 % CM | 1.8 % CM |
| Anhydrite screeds | 0.5 % CM | 0.3 % CM |
| Magnetite flooring | 3–12 % CM 1 | 3–12 % CM 1 |
1 Depending on the organic content
Note: These values are only indicative. The actual permissible substrate moisture content depends on the specific screed composition. For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.
Curing Rate
~4.0 mm/24 hours (23 °C / 50 % r.h.)
Skin Time / Laying Time
~60 minutes (23 °C / 50 % r.h.)
Consumption
Full Surface Bonding
| Type of Wood Floor | Consumption | Notched Trowel |
| Lam parquet, mosaic parquet and industrial parquet | 600–800 g/m2 | B3 (TKB Germany) |
| Engineered wood strips and planks, lam and mosaic parquet | 700–900 g/m2 | B6 (TKB Germany) SC+ MB (US Standard) |
| Solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, chipboard | 800–1000 g/m2 | B11 (TKB Germany) P5 (US Standard) |
For bonding long or wide boards, or when working on uneven substrates, it may be necessary to use a notched trowel with bigger notches to ensure that a sufficient amount of SikaBond®-54 Parquet is applied to provide a uniform adhesive surface and for preventing hollow sections i.e. without full surface bond.
For substrates primed with Sika® Primer MR Fast or Sika® Primer MB, the consumption of SikaBond®-54 Parquet may be reduced.
APPLICATION INSTRUCTIONS
For the application of SikaBond®-54 Parquet all generally accepted rules for wood flooring installation apply.
For further information, please refer to the Method Statement "Full Surface Bonding".
SUBSTRATE PREPARATION
- The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
- Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
- Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
- Broadcast mastic asphalt must be primed with Sika® Primer MR Fast or Sika® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet.
- Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
- Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact Sika technical service.
- For other substrates contact our Sika technical service for advice and assistance.
- SikaBond®-54 Parquet can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
- For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika® Primer MB. For detailed instructions contact Sika technical service.
CLEANING OF TOOLS
Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.