
SikaBond®-151
SikaBond®-151 is a 1-part wood floor adhesive for all types of wood flooring and suitable for most common types of floor substrates. The elastic adhesive is easy to spread while maintaining stable trowel peaks.
- Easy to spread
- Stable trowel peaks
- Good varnish compatibility
- Walkable after 8 hours
- Very low emissions
Usage
Full surface bonding of wood floor types:- Engineered wood
- Mosaic parquet
- Lamparquet (≤ 55 × 220 mm, thickness ≥ 10 mm)
- Solid planks (10 x thickness > width)
- Concrete screed
- Cement screed
- Magnesite screed
- Calcium sulphate screed
- Parquet
- Plywood
- Chipboard (V100)
- OSB
Advantages
- Easy to spread
- Stable trowel peaks
- Good varnish compatibility
- Walkable after 8 hours
- Very low emissions
Packaging
17 kg container | |
4 kg foil pack | 4 foil packs per box. |
600 ml foil pack (~1,0 kg) | 20 foil packs per box. |
Refer to current price list for packaging variations.
Colour
Parquet brown
Product Details
ENVIRONMENTAL INFORMATION
- Conformity with LEED v4 EQc 2: Low-Emitting Materials
- VOC emission classification GEV-EMICODE EC 1PLUS
- Class A+ according to French Regulation on VOC emissions
- VOC emission certificate according to AgBB und DIBt approval requirements, test report No.Z-155.10-498
- IBU Environmental Product Declaration (EPD) available
Chemical Base
Silane modified polymer
Shelf Life
12 months from the date of production
Storage Conditions
The product must be stored in original, unopened and undamaged sealed packaging in dry conditions at temperatures between +5 °C and +25 °C. Always refer to packaging.
Density
~1,65 kg/l | (ISO 1183-1) |
Shear Strength
Elastic adhesive | (ISO 17178) |
Service Temperature
+5 °C min. / +40 °C max.
Application
Sag Flow
SikaBond®-151 spreads easily while maintaining stable trowel peaks.
Ambient Air Temperature
+15 °C min. / +35 °C max.
Relative Air Humidity
40 % min. / 70 % max.
Substrate Temperature
+15 °C min. / +35 °C max. (+20 °C min. / +35 °C max with underfloor heating). Temperatures should be maintained during application and until fully cured.
Curing Time
Walkable | ~8 hours |
Sandable | ~12 hours |
Fully cured | ~48–72 hours |
Curing times depend on environmental and subfloor conditions, adhesive layer thickness and wood flooring type. The above curing times were determined at +23 °C / 50 % r.h.
Skin Time / Laying Time
~40 minutes (+23 °C / 50 % r.h.)
Consumption
Consumption (Full surface bonding) | V-Notched trowel type (TKB Germany) |
800−1000 g/m2 | Trowel B3 |
900–1200 g/m2 | Trowel B6 |
1000–1300 g/m2 | Trowel B11 / P5 |
When bonding long or wide boards or applying on uneven substrates a sufficient amount of adhesive must be applied to provide full surface bonding. Substrates primed with Sika® Primer MR Fast or Sika® Primer MB, may reduce the consumption.
SUBSTRATE PREPARATION
General
The substrate must be sound, clean, dry and free of all contaminants such as dirt, oil, grease, cement laitance, wax, varnish, old adhesive residue and poorly bonded paint coatings which could affect adhesion.
All dust, loose and friable material must be completely removed from all surfaces before the application of SikaBond®-151, preferably by vacuum extraction equipment.
Concrete / cementitious screeds
Substrate must be ground flat to provide a smooth surface without any irregularities. Fill any voids or cavities with appropriate Sika® compatible flooring repair or levelling products.
Calcium sulphate (Anhydrite) screeds
Substrate must be ground flat to provide a smooth surface without any irregularities. Fill any voids or cavities with appropriate Sika® compatible flooring repair or levelling products.
Mastic asphalt
Prime with Sika® Primer MR Fast or Sika® Primer MB and broadcast with quartz sand. Refer to individual Product Data Sheets.
Glazed ceramic and old existing ceramic tiles
Degrease and clean with Sika® Aktivator-205. Alternatively tile surfaces must be ground to remove the glaze.
Wood
Wood types such as chipboards (V100), OSB or plywood as well as gypsum boards must be securely fixed to the substructure. Remove any surface irregularities using appropriate equipment. For floating dry-floors, contact Sika Technical Services for additional information.
Other substrate types
Contact Sika Technical Services.
Priming
SikaBond®-151 can be used without priming on concrete / cementitious/ anhydrite screeds, chipboards, concrete and ceramic tiles.
For broadcasted mastic asphalt, concrete / cementitious subfloors or screeds with excessive moisture content, old adhesive residue or weak substrates, Sika® Primer MB must be used. Refer to individual Product Data Sheet or contact Sika Technical Services for additional information.
Before wood floors may be installed in non-insulated areas, such as basements or other areas without a damp proof membrane, Sikafloor®EpoCem must be applied and sealed with Sika®Primer MB to control the moisture. Contact Sika Technical Services for additional information.
CLEANING OF TOOLS
Clean all tools and application equipment immediately after use with Sika® Remover-208. Once cured, hardened material can only be removed mechanically.
For cleaning skin use Sika® Cleaning Wipes-100.